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Towards increased understanding of novel laminated packaging materials
Engqvist, Jonas
(PI)
Solid Mechanics
LTH Profile Area: Nanoscience and Semiconductor Technology
Project
:
Research
Overview
Infrastructure
(1)
Project Details
Status
Active
Effective start/end date
2023/01/01
→
2028/12/31
Funding
Stora Enso Oyj
View all
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Infrastructure
4D Imaging Lab
Hall, S.
(Manager) &
Engqvist, J.
(Contact)
Solid Mechanics
Infrastructure