Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS)

O. Abdelrahman; J.K. Gumprecht; I. Panasenko; S. Paniskaki; D. Silvermyr; J. Staa; A. Zingaretti; et al.

doi:10.1016/j.nima.2026.171297

Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS)

O. Abdelrahman, J.K. Gumprecht, I. Panasenko, S. Paniskaki, D. Silvermyr, J. Staa, A. Zingaretti, et al.

Particle and nuclear physics

Research output: Contribution to journal › Article › peer-review

Abstract

This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026–2030). The MOSS chip design is driven by the truly cylindrical detector geometry that imposes that each layer is built out of two wafer-sized, bent silicon chips. The stitching technique is employed to fabricate sensors with dimensions of 1.4 cm × 25.9 cm, thinned to 50 μm. The chip architecture, the in-pixel front-end, the laboratory and in-beam characterisation, the susceptibility to single-event effects, and the series testing are discussed. The testing campaign validates the design of a wafer-scale stitched sensor and the performance of the pixel matrix to be within the ITS3 requirements. The MOSS chip demonstrates the feasibility of the ITS3 detector concept and provides insights for further optimisation and development. © 2026 The Authors

Original language	English
Article number	171297
Journal	Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment
Volume	1086
DOIs	https://doi.org/10.1016/j.nima.2026.171297
Publication status	Published - 2026

Subject classification (UKÄ)

Subatomic Physics

Free keywords

CMOS stitching
Monolithic active pixel sensors
Silicon sensors
Solid state detectors
Fabrication
Integrated circuit design
Pixels
Silicon detectors
Solid-state sensors
WSI circuits
Characterization and testing
Chip design
Cylindrical detectors
Detector geometry
Monolithics
Sensor chips
Wafer scale
Silicon wafers

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10.1016/j.nima.2026.171297Licence: CC BY

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Abdelrahman, O., Gumprecht, J. K., Panasenko, I., Paniskaki, S., Silvermyr, D., Staa, J., Zingaretti, A., & et al. (2026). Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS). Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 1086, Article 171297. https://doi.org/10.1016/j.nima.2026.171297

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title = "Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS)",

abstract = "This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026–2030). The MOSS chip design is driven by the truly cylindrical detector geometry that imposes that each layer is built out of two wafer-sized, bent silicon chips. The stitching technique is employed to fabricate sensors with dimensions of 1.4 cm × 25.9 cm, thinned to 50 μm. The chip architecture, the in-pixel front-end, the laboratory and in-beam characterisation, the susceptibility to single-event effects, and the series testing are discussed. The testing campaign validates the design of a wafer-scale stitched sensor and the performance of the pixel matrix to be within the ITS3 requirements. The MOSS chip demonstrates the feasibility of the ITS3 detector concept and provides insights for further optimisation and development. {\textcopyright} 2026 The Authors",

keywords = "CMOS stitching, Monolithic active pixel sensors, Silicon sensors, Solid state detectors, Fabrication, Integrated circuit design, Pixels, Silicon detectors, Solid-state sensors, WSI circuits, Characterization and testing, Chip design, Cylindrical detectors, Detector geometry, Monolithics, Sensor chips, Wafer scale, Silicon wafers",

author = "O. Abdelrahman and J.K. Gumprecht and I. Panasenko and S. Paniskaki and D. Silvermyr and J. Staa and A. Zingaretti and \{et al.\}",

year = "2026",

doi = "10.1016/j.nima.2026.171297",

language = "English",

volume = "1086",

journal = "Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment",

issn = "0168-9002",

publisher = "Elsevier",

}

Abdelrahman, O, Gumprecht, JK, Panasenko, I, Paniskaki, S, Silvermyr, D , Staa, J, Zingaretti, A & et al. 2026, 'Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS)', Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, vol. 1086, 171297. https://doi.org/10.1016/j.nima.2026.171297

Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS). / Abdelrahman, O.; Gumprecht, J.K.; Panasenko, I. et al.
In: Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, Vol. 1086, 171297, 2026.

Research output: Contribution to journal › Article › peer-review

TY - JOUR

T1 - Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS)

AU - Abdelrahman, O.

AU - Gumprecht, J.K.

AU - Panasenko, I.

AU - Paniskaki, S.

AU - Silvermyr, D.

AU - Staa, J.

AU - Zingaretti, A.

AU - et al.

PY - 2026

Y1 - 2026

N2 - This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026–2030). The MOSS chip design is driven by the truly cylindrical detector geometry that imposes that each layer is built out of two wafer-sized, bent silicon chips. The stitching technique is employed to fabricate sensors with dimensions of 1.4 cm × 25.9 cm, thinned to 50 μm. The chip architecture, the in-pixel front-end, the laboratory and in-beam characterisation, the susceptibility to single-event effects, and the series testing are discussed. The testing campaign validates the design of a wafer-scale stitched sensor and the performance of the pixel matrix to be within the ITS3 requirements. The MOSS chip demonstrates the feasibility of the ITS3 detector concept and provides insights for further optimisation and development. © 2026 The Authors

AB - This paper presents the characterisation and testing of the first wafer-scale monolithic stitched sensor (MOSS) prototype developed for the ALICE ITS3 upgrade that is to be installed during the LHC Long Shutdown 3 (2026–2030). The MOSS chip design is driven by the truly cylindrical detector geometry that imposes that each layer is built out of two wafer-sized, bent silicon chips. The stitching technique is employed to fabricate sensors with dimensions of 1.4 cm × 25.9 cm, thinned to 50 μm. The chip architecture, the in-pixel front-end, the laboratory and in-beam characterisation, the susceptibility to single-event effects, and the series testing are discussed. The testing campaign validates the design of a wafer-scale stitched sensor and the performance of the pixel matrix to be within the ITS3 requirements. The MOSS chip demonstrates the feasibility of the ITS3 detector concept and provides insights for further optimisation and development. © 2026 The Authors

KW - CMOS stitching

KW - Monolithic active pixel sensors

KW - Silicon sensors

KW - Solid state detectors

KW - Fabrication

KW - Integrated circuit design

KW - Pixels

KW - Silicon detectors

KW - Solid-state sensors

KW - WSI circuits

KW - Characterization and testing

KW - Chip design

KW - Cylindrical detectors

KW - Detector geometry

KW - Monolithics

KW - Sensor chips

KW - Wafer scale

KW - Silicon wafers

U2 - 10.1016/j.nima.2026.171297

DO - 10.1016/j.nima.2026.171297

M3 - Article

SN - 0168-9002

VL - 1086

JO - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

JF - Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

M1 - 171297

ER -

Abdelrahman O, Gumprecht JK, Panasenko I, Paniskaki S, Silvermyr D , Staa J et al. Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS). Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 2026;1086:171297. doi: 10.1016/j.nima.2026.171297

Characterisation of the first wafer-scale prototype for the ALICE ITS3 upgrade: The monolithic stitched sensor (MOSS)

Abstract

Subject classification (UKÄ)

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