Abstract
Stochastic optimization methods are commonly used in the design process of power electronic systems. These require models of crucial parts of the system which are both scalable and computationally efficient. This paper presents thermal models for traction inverter power modules based on scalable chip area that provide high speed of execution and accuracy. The thermal model includes chip-chip interaction, heat spreading and the effects of chip density inside the package.
Original language | English |
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Title of host publication | 2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023 |
Publisher | IEEE - Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9798350397420 |
DOIs | |
Publication status | Published - 2023 |
Event | 2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023 - Detroit, United States Duration: 2023 Jun 21 → 2023 Jun 23 |
Conference
Conference | 2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023 |
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Country/Territory | United States |
City | Detroit |
Period | 2023/06/21 → 2023/06/23 |
Subject classification (UKÄ)
- Other Electrical Engineering, Electronic Engineering, Information Engineering
Free keywords
- Optimzation
- power module
- scalable model
- thermal model