Abstract
The development of corner folds in liquid board packages is sometimes observed in the forming section during package forming. In this work the problem is approached by the use of FE simulations. It is concluded that corner folds can be triggered in the simulations for a specific set of material properties and forming machine parameters.
Original language | English |
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Title of host publication | [Host publication title missing] |
Publisher | Appita |
Pages | 217-221 |
Number of pages | 5 |
ISBN (Print) | 9780975746928 |
Publication status | Published - 2007 |
Event | International Paper Physics Conference - Gold Coast, Australia Duration: 2007 May 6 → 2007 May 10 |
Conference
Conference | International Paper Physics Conference |
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Country/Territory | Australia |
City | Gold Coast |
Period | 2007/05/06 → 2007/05/10 |
Subject classification (UKÄ)
- Mechanical Engineering
Free keywords
- FE simulations
- Liquid board
- package forming
- corner folds