Abstract
We demonstrate a successful process scheme for the integration of a CMOS-compatible ferroelectric gate stack on a scaled vertical InAs nanowire gate-all-around MOSFET on silicon. The devices show promising device characteristics with nanosecond write time and large memory window of >1.5 V. In the current implementation, the device performance is mainly limited by access resistance, which is attributed to the thermal sensitivity of InAs. The findings indicate that the ferroelectricity is not intrinsically preventing future improvements of scaled III-V FeFETs.
| Original language | English |
|---|---|
| Pages (from-to) | 854 - 857 |
| Journal | IEEE Electron Device Letters |
| Volume | 43 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2022 Jun |
Subject classification (UKÄ)
- Other Electrical Engineering, Electronic Engineering, Information Engineering
Fingerprint
Dive into the research topics of 'Integration of Ferroelectric HfxZr1-xO2 on Vertical III-V Nanowire Gate-All-Around FETs on Silicon'. Together they form a unique fingerprint.Research output
- 1 Doctoral Thesis (compilation)
-
Ferroelectric Memristors - Materials, Interfaces and Applications
Athle, R., 2024 Feb, Lund: Department of Electrical and Information Technology, Lund University. 278 p.Research output: Thesis › Doctoral Thesis (compilation)
File
Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver