Abstract

Nanometric cutting of a single crystal copper workpiece of different crystallographic orientations by a stiff cylindrical cubic diamond tool has been investigated by MD simulations using the freeware LAMMPS. The chip evolves during the cutting process and forms depending on crystal orientation, cutting velocity and tool geometry. It was found that no significant difference in the cutting force magnitude was observed for different crystallographic orientations despite significant differences in deformation patterns. After tool passage the surface is smooth and no elastic recovery was detected. Instead, a grain structure with areas surrounded by dislocation clusters form in the tool wake. Increasing the cutting velocity promotes chip formation and chip folding, thus increasing the chip thickness.

Original languageEnglish
Title of host publicationMaterials Structure & Micromechanics of Fracture
EditorsJaroslav Pokluda, Pavel Sandera
PublisherElsevier
Pages9-14
Number of pages6
DOIs
Publication statusPublished - 2023
EventTenth International Conference on Materials Structure & Micromecanics of fracture, MSMF10 - Brno, Czech Republic
Duration: 2022 Sept 122022 Sept 14

Publication series

NameProcedia Structural Integrity
PublisherElsevier
Volume43
ISSN (Print)2452-3216

Conference

ConferenceTenth International Conference on Materials Structure & Micromecanics of fracture, MSMF10
Country/TerritoryCzech Republic
CityBrno
Period2022/09/122022/09/14

Subject classification (UKÄ)

  • Manufacturing, Surface and Joining Technology

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