Nanoindentation of thin copper coatings

Per Hansson, M. Jansson

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceedingpeer-review


The structure of interest is a thin, metallic coating of fcc copper, of thickness down to a few nanometers only, resting on a stiffer substrate. The elastic and plastic properties of the thin coating using nanoindentation under different geometrical features such as size of the indenter and coating thickness are determined. The force-displacement curve is monitored during indentation and the precise conditions for the occurrence of so called pop-ins during loading are investigated. To simulate the nanoindentation process, a molecular dynamics approach is used, where an infinitely stiff indenter is pushed into the coating under displacement control. The coating is modeled as a thin rectangular plate, with the bottom atom layers locked from movement, simulating the stiffer substrate, and periodic boundary conditions in the plane of the plate are applied.
Original languageEnglish
Title of host publicationMaterials Structure & Micromechanics of Fracture VII (Key Engineering Materials)
PublisherTrans Tech Publications
Publication statusPublished - 2014
Event7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7) - Brno, Czech Republic
Duration: 2013 Jul 12013 Jul 3

Publication series

ISSN (Print)1013-9826


Conference7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7)
Country/TerritoryCzech Republic

Subject classification (UKÄ)

  • Applied Mechanics

Free keywords

  • Nanoindentation
  • molecular dynamics
  • thin coating


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