Abstract
We demonstrate junctionless tri-gate MOSFETs utilizing a single layer 7 nm thick In0.80Ga0.20As (ND ∼ 1×1019 cm-3) as both channel and contacts. Devices with source and drain metal separation of 32 nm and Lg of 25 nm exhibit SS = 76 mV/dec., both the highest reported gm = 1.6 mS/μα and Ion = 160 μA/μm (VDD = 0.5 V, IOFF = 100 nA/μm) for a junctionless transistor. We also examine the influence of the contact thickness, comparing double-layer junctionless devices with 37 nm thick contacts with single-layer 7 nm contact devices.
Original language | English |
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Title of host publication | 2017 Symposium on VLSI Technology, VLSI Technology 2017 |
Publisher | IEEE - Institute of Electrical and Electronics Engineers Inc. |
Pages | T34-T35 |
ISBN (Electronic) | 9784863486058 |
DOIs | |
Publication status | Published - 2017 Jul 31 |
Event | 37th Symposium on VLSI Technology, VLSI Technology 2017 - Kyoto, Japan Duration: 2017 Jun 5 → 2017 Jun 8 |
Conference
Conference | 37th Symposium on VLSI Technology, VLSI Technology 2017 |
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Country/Territory | Japan |
City | Kyoto |
Period | 2017/06/05 → 2017/06/08 |
Subject classification (UKÄ)
- Electrical Engineering, Electronic Engineering, Information Engineering