Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceedingpeer-review

Original languageEnglish
Title of host publicationSimulating nanoindentation of thin Cu films using molecular dynamics and peridynamics
Number of pages4
Publication statusPublished - 2016
Event8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Czech Republic
Duration: 2016 Jun 272016 Jun 29

Publication series

NameProseeding to  the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE

Conference

Conference8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
Country/TerritoryCzech Republic
CityBrno
Period2016/06/272016/06/29

Subject classification (UKÄ)

  • Applied Mechanics

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