Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics

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Abstract

Nanoindentation is a useful experimental method to characterize the micromechanical properties of materials. In this study molecular dynamics and peridynamics are used to simulate nanoindentation, with a spherical indenter targeting a thin single crystal Cu film, resting on an infinitely stiff substrate. The objective is to compare the results obtained from molecular dynamic simulations to those obtained using a peridynamic approach as regards the force-displacement curves and the deformation patterns after that the material parameters in the peridynamic model have been fitted to the force displacement curve from the molecular dynamic simulation.

Original languageEnglish
Pages (from-to)25-28
Number of pages4
JournalSolid State Phenomena
Volume258 SSP
DOIs
Publication statusPublished - 2017
Event8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Czech Republic
Duration: 2016 Jun 272016 Jun 29

Subject classification (UKÄ)

  • Applied Mechanics

Keywords

  • Molecular dynamics
  • Nano indentation
  • Peridynamics
  • Thin films

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