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Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics

    Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceedingpeer-review

    Original languageEnglish
    Title of host publicationSimulating nanoindentation of thin Cu films using molecular dynamics and peridynamics
    Number of pages4
    Publication statusPublished - 2016
    Event8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Czech Republic
    Duration: 2016 Jun 272016 Jun 29

    Publication series

    NameProseeding to  the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE

    Conference

    Conference8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
    Country/TerritoryCzech Republic
    CityBrno
    Period2016/06/272016/06/29

    Subject classification (UKÄ)

    • Applied Mechanics

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