Simulation of Dynamic Discontinuous Recrystallization During Hot Deformation of Pure Copper

A probabilistic cellular automaton technique is employed in the simulation of dynamic discontinuous recrystallization (DDRX) in pure copper under hot deformation conditions. Important features of the present model are calibration of grain growth kinetics against the analytical solution and also the description of a misorientation-dependent grain boundary energy, valid in the entire range of misorientation angles. The model is shown to capture both the spatial and temporal microstructural evolution in terms of grain size and grain shape changes and also the macroscopic flow stress behavior of the material. In accordance with experimental findings, the material exhibits serrated flow stress at higher temperatures due to cycles of recrystallization.