Spherical Large Intelligent Surfaces

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceedingpeer-review

Abstract

As an emerging technology and evolution that goes beyond massive multi-input multi-output (MIMO), large intelligent surface (LIS) has gained much interest. LIS acts as an electromagnetic surface that can transmit, redirect, and receive radiating signals across its entire contiguous surface. It allows for unprecedented energy-focusing, data-transmission and terminal-positioning, and can fulfill the most grand visions for future communication systems. Earlier proposed LISs are in two-dimensional (2D), i.e., planar shapes. In this paper, we extend LISs to be three-dimensional (3D) and deployed as spherical surfaces. Compared to 2D LIS, a spherical LIS has advantages in wide coverage, simple positioning technique, and flexible deployment as reflecting surface.

Original languageEnglish
Title of host publication2020 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2020 - Proceedings
PublisherIEEE - Institute of Electrical and Electronics Engineers Inc.
Pages8673-8677
Number of pages5
ISBN (Electronic)9781509066315
DOIs
Publication statusPublished - 2020
Event2020 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2020 - Barcelona, Spain
Duration: 2020 May 42020 May 8

Publication series

NameICASSP, IEEE International Conference on Acoustics, Speech and Signal Processing - Proceedings
Volume2020-May
ISSN (Print)1520-6149

Conference

Conference2020 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2020
Country/TerritorySpain
CityBarcelona
Period2020/05/042020/05/08

Subject classification (UKÄ)

  • Communication Systems

Free keywords

  • Large intelligent surface (LIS)
  • positioning
  • received signal strength (RSS)
  • reflector
  • spherical

Fingerprint

Dive into the research topics of 'Spherical Large Intelligent Surfaces'. Together they form a unique fingerprint.

Cite this