Stress and displacement configurations in the vicinity of a void in a nanometer copper strip

Dan Johansson, Per Hansson, Solveig Melin

Research output: Contribution to journalArticlepeer-review

2 Citations (SciVal)

Abstract

Molecular dynamics is used to simulate nanometer-sized copper strips. The strips are highly constrained and chosen to mimic thin films between two stiff layers. Further, the strips hold centrally placed straight through crack shaped voids, and are subjected to tensile displacement controlled mode I loading. The tensile stresses and displacements are studied. It is found that if a copper strip is 2.16906. nm in a direction orthogonal to the loading direction, the strip does not experience plane strain conditions. However, if this dimension is ≥3.6151. nm, the strip shows states of both plane stress and plane strain.

Original languageEnglish
Pages (from-to)139-146
Number of pages8
JournalEngineering Fracture Mechanics
Volume152
DOIs
Publication statusPublished - 2016 Feb 1

Subject classification (UKÄ)

  • Mechanical Engineering

Keywords

  • Fracture mechanics
  • Molecular dynamics
  • Plane strain
  • Plane stress
  • Size dependence nano-sized strip

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