Tensile behavior of single-crystal nano-sized copper beams with voids

    Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceedingpeer-review

    Abstract

    The tensile response under displacement controlled loading of nano-sized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.

    Original languageEnglish
    Title of host publicationMaterials Structure and Micromechanics of Fracture VIII
    PublisherTrans Tech Publications
    Pages53-56
    Number of pages4
    Volume258 SSP
    ISBN (Print)9783038356264
    DOIs
    Publication statusPublished - 2017
    Event8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Czech Republic
    Duration: 2016 Jun 272016 Jun 29

    Publication series

    NameSolid State Phenomena
    Volume258 SSP
    ISSN (Electronic)16629779

    Conference

    Conference8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
    Country/TerritoryCzech Republic
    CityBrno
    Period2016/06/272016/06/29

    Subject classification (UKÄ)

    • Applied Mechanics

    Free keywords

    • MD simulations
    • Single crystal Cu
    • Tensile Strength
    • Void size effects
    • Voids in nano-beams

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