Tensile behavior of single-crystal nano-sized copper beams with voids

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceedingpeer-review

Abstract

The tensile response under displacement controlled loading of nano-sized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.

Original languageEnglish
Title of host publicationMaterials Structure and Micromechanics of Fracture VIII
PublisherTrans Tech Publications
Pages53-56
Number of pages4
Volume258 SSP
ISBN (Print)9783038356264
DOIs
Publication statusPublished - 2017
Event8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Czech Republic
Duration: 2016 Jun 272016 Jun 29

Publication series

NameSolid State Phenomena
Volume258 SSP
ISSN (Electronic)16629779

Conference

Conference8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
Country/TerritoryCzech Republic
CityBrno
Period2016/06/272016/06/29

Subject classification (UKÄ)

  • Applied Mechanics

Keywords

  • MD simulations
  • Single crystal Cu
  • Tensile Strength
  • Void size effects
  • Voids in nano-beams

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