Achieving short high-quality gate-all-around structures for horizontal nanowire field-effect transistors

Research output: Contribution to journalArticle


We introduce a fabrication method for gate-all-around nanowire field-effect transistors. Single nanowires were aligned perpendicular to underlying bottom gates using a resist-trench alignment technique. Top gates were then defined aligned to the bottom gates to form gate-all-around structures. This approach overcomes significant limitations in minimal obtainable gate length and gate-length control in previous horizontal wrap-gated nanowire transistors that arise because the gate is defined by wet-etching. In the method presented here gate-length control is limited by the resolution of the electron-beam-lithography process. We demonstrate the versatility of our approach by fabricating a device with an independent bottom gate, top gate, and gate-all-around structure as well as a device with three independent gate-all-around structures with 300, 200, and 150 nm gate length. Our method enables us to achieve subthreshold swings as low as 38 mV dec-1 at 77 K for a 150 nm gate length.


External organisations
  • University of New South Wales
  • Victoria University of Wellington
  • University of Copenhagen
Research areas and keywords

Subject classification (UKÄ) – MANDATORY

  • Nano Technology


  • field-effect transistor, GAA, gate-all-around, nanowire, nanowire alignment
Original languageEnglish
Article number064001
Issue number6
Publication statusPublished - 2018
Publication categoryResearch