An Area Efficient Single-Cycle xVDD Sub-Vth on-Chip Boost Scheme in 28 nm FD-SOI
Research output: Chapter in Book/Report/Conference proceeding › Paper in conference proceeding
Abstract
An on-chip, low power, and area efficient charge-pump (CP) that generates a multiple of the supply voltage (VDD) in a single clock cycle is presented. The proposed CP utilizes parallel cross-connected CP units, which are implemented using MIM (metal-insulator-metal) capacitors. In the target application, i.e., a sub-threshold SRAM, the capacitors are accommodated on top of the memory banks to remove their area cost, which dominates in a CP realization. In this work, 66 instances of the proposed CP are fully integrated on-chip to assist read and write operations. The design is manufactured in a commercial 28nm FD-SOI technology and different design parameters were verified by measurements. The results verify an increased system-wise performance and power efficiency at a low area overhead of 3.7%. A performance of 37.5MHz for a boost ratio of 2×, and an average energy dissipation of 41 fJ per operation, was observed at 0.36V.
Details
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Research areas and keywords | Subject classification (UKÄ) – MANDATORY
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Original language | English |
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Title of host publication | 2016 IEEE Asian Solid-State Circuits Conference (A-SSCC) |
Publisher | IEEE - Institute of Electrical and Electronics Engineers Inc. |
Pages | 229-232 |
ISBN (Electronic) | 978-150903700-1 |
Publication status | Published - 2017 |
Publication category | Research |
Peer-reviewed | Yes |
Event | IEEE Asian Solid-State Circuits Conference (A-SSCC ). 2016 - Toyama International Conference Center, Toyama, Japan Duration: 2016 Nov 7 → 2016 Nov 9 |
Conference
Conference | IEEE Asian Solid-State Circuits Conference (A-SSCC ). 2016 |
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Country | Japan |
City | Toyama |
Period | 2016/11/07 → 2016/11/09 |