Forming performance of liquid board packages; corner fold development

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceeding

Abstract

The development of corner folds in liquid board packages is sometimes observed in the forming section during package forming. In this work the problem is approached by the use of FE simulations. It is concluded that corner folds can be triggered in the simulations for a specific set of material properties and forming machine parameters.

Details

Authors
Organisations
Research areas and keywords

Subject classification (UKÄ) – MANDATORY

  • Mechanical Engineering

Keywords

  • FE simulations, Liquid board, package forming, corner folds
Original languageEnglish
Title of host publication[Host publication title missing]
PublisherAppita
Pages217-221
Number of pages5
ISBN (Print)9780975746928
Publication statusPublished - 2007
Publication categoryResearch
Peer-reviewedYes
EventInternational Paper Physics Conference - Gold Coast, Australia
Duration: 2007 May 62007 May 10

Conference

ConferenceInternational Paper Physics Conference
CountryAustralia
CityGold Coast
Period2007/05/062007/05/10