Forming performance of liquid board packages; corner fold development

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceeding

Standard

Forming performance of liquid board packages; corner fold development. / Nyman, Ulf; Magnusson, Anders; Ristinmaa, Matti.

[Host publication title missing]. Appita, 2007. p. 217-221.

Research output: Chapter in Book/Report/Conference proceedingPaper in conference proceeding

Harvard

Nyman, U, Magnusson, A & Ristinmaa, M 2007, Forming performance of liquid board packages; corner fold development. in [Host publication title missing]. Appita, pp. 217-221, International Paper Physics Conference, Gold Coast, Australia, 2007/05/06.

APA

Nyman, U., Magnusson, A., & Ristinmaa, M. (2007). Forming performance of liquid board packages; corner fold development. In [Host publication title missing] (pp. 217-221). Appita.

CBE

Nyman U, Magnusson A, Ristinmaa M. 2007. Forming performance of liquid board packages; corner fold development. In [Host publication title missing]. Appita. pp. 217-221.

MLA

Nyman, Ulf, Anders Magnusson, and Matti Ristinmaa "Forming performance of liquid board packages; corner fold development". [Host publication title missing]. Appita. 2007, 217-221.

Vancouver

Nyman U, Magnusson A, Ristinmaa M. Forming performance of liquid board packages; corner fold development. In [Host publication title missing]. Appita. 2007. p. 217-221

Author

Nyman, Ulf ; Magnusson, Anders ; Ristinmaa, Matti. / Forming performance of liquid board packages; corner fold development. [Host publication title missing]. Appita, 2007. pp. 217-221

RIS

TY - GEN

T1 - Forming performance of liquid board packages; corner fold development

AU - Nyman, Ulf

AU - Magnusson, Anders

AU - Ristinmaa, Matti

PY - 2007

Y1 - 2007

N2 - The development of corner folds in liquid board packages is sometimes observed in the forming section during package forming. In this work the problem is approached by the use of FE simulations. It is concluded that corner folds can be triggered in the simulations for a specific set of material properties and forming machine parameters.

AB - The development of corner folds in liquid board packages is sometimes observed in the forming section during package forming. In this work the problem is approached by the use of FE simulations. It is concluded that corner folds can be triggered in the simulations for a specific set of material properties and forming machine parameters.

KW - FE simulations

KW - Liquid board

KW - package forming

KW - corner folds

M3 - Paper in conference proceeding

SN - 9780975746928

SP - 217

EP - 221

BT - [Host publication title missing]

PB - Appita

T2 - International Paper Physics Conference

Y2 - 6 May 2007 through 10 May 2007

ER -