Paperboard packages exposed to static loads–finite element modelling and ­experiments

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Paperboard packages exposed to static loads–finite element modelling and ­experiments. / Beldie, Liliana; Sandberg, Göran.

In: Packaging Technology & Science, Vol. 14, No. 4, 2001, p. 171-178.

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TY - JOUR

T1 - Paperboard packages exposed to static loads–finite element modelling and ­experiments

AU - Beldie, Liliana

AU - Sandberg, Göran

PY - 2001

Y1 - 2001

N2 - The aim of this study was to analyse the mechanical behaviour of paperboard packages subjected to static compressive loads. The study was divided in three parts and experiments and finite element analysis conducted for each part. First, a panel of paperboard was subjected to edge compressive loading as a means of checking the material model. Second, the package was cut into segments and each segment was subjected to compression in order to determine the contribution of the different parts to the overall behaviour of the package. Third, a whole package loaded in compression was studied. In the finite element simulations, the paperboard was modelled as an orthotropic, linear, elastic–plastic laminate. The study utilized a non-linear finite element analysis, based on the plasticity of the material and large displacements. The results show that the middle segment of the package exhibits a higher stiffness than that of the upper and lower package segments and that of the whole package, which leads to the conclusion that the low initial stiffness of the package is a consequence of the low stiffness of the upper and lower corners, i.e. of the horizontal creases. Copyright © 2001 John Wiley & Sons, Ltd.

AB - The aim of this study was to analyse the mechanical behaviour of paperboard packages subjected to static compressive loads. The study was divided in three parts and experiments and finite element analysis conducted for each part. First, a panel of paperboard was subjected to edge compressive loading as a means of checking the material model. Second, the package was cut into segments and each segment was subjected to compression in order to determine the contribution of the different parts to the overall behaviour of the package. Third, a whole package loaded in compression was studied. In the finite element simulations, the paperboard was modelled as an orthotropic, linear, elastic–plastic laminate. The study utilized a non-linear finite element analysis, based on the plasticity of the material and large displacements. The results show that the middle segment of the package exhibits a higher stiffness than that of the upper and lower package segments and that of the whole package, which leads to the conclusion that the low initial stiffness of the package is a consequence of the low stiffness of the upper and lower corners, i.e. of the horizontal creases. Copyright © 2001 John Wiley & Sons, Ltd.

KW - finite element method

KW - stiffness

KW - compression

U2 - 10.1002/pts.546

DO - 10.1002/pts.546

M3 - Article

VL - 14

SP - 171

EP - 178

JO - Packaging Technology and Science

T2 - Packaging Technology and Science

JF - Packaging Technology and Science

SN - 0894-3214

IS - 4

ER -