Journal of Electronic Packaging, Transactions of the ASME, 1043-7398

Tidskrift

Fler filtreringsmöjligheter
  1. 2014
  2. Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

    Xie, G., Asadi, M., Bengt Sundén & Zheng, S., 2014, I : Journal of Electronic Packaging. 136, 3, 031013.

    Forskningsoutput: TidskriftsbidragArtikel i vetenskaplig tidskrift

  3. Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

    Bengt Sundén & Xie, G., 2014, I : Journal of Electronic Packaging. 136, 2, 024501.

    Forskningsoutput: TidskriftsbidragArtikel i vetenskaplig tidskrift

  4. 2013
  5. Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling

    Xie, G., Liu, J., Liu, Y., Bengt Sundén & Zhang, W., 2013, I : Journal of Electronic Packaging. 135, 2, 021008.

    Forskningsoutput: TidskriftsbidragArtikel i vetenskaplig tidskrift

  6. 2012
  7. Analysis of Flow and Thermal Performance of a Water-Cooled Transversal Wavy Microchannel Heat Sink for Chip Cooling

    Xie, G., Liu, J., Zhang, W. & Bengt Sundén, 2012, I : Journal of Electronic Packaging. 134, 4, 041010.

    Forskningsoutput: TidskriftsbidragArtikel i vetenskaplig tidskrift