Forming performance of liquid board packages; corner fold development

Forskningsoutput: Kapitel i bok/rapport/Conference proceedingKonferenspaper i proceeding

Abstract

The development of corner folds in liquid board packages is sometimes observed in the forming section during package forming. In this work the problem is approached by the use of FE simulations. It is concluded that corner folds can be triggered in the simulations for a specific set of material properties and forming machine parameters.

Detaljer

Författare
Enheter & grupper
Forskningsområden

Ämnesklassifikation (UKÄ)

  • Maskinteknik

Nyckelord

Originalspråkengelska
Titel på värdpublikation[Host publication title missing]
FörlagAppita
Sidor217-221
Antal sidor5
ISBN (tryckt)9780975746928
StatusPublished - 2007
PublikationskategoriForskning
Peer review utfördJa
EvenemangInternational Paper Physics Conference - Gold Coast, Australien
Varaktighet: 2007 maj 62007 maj 10

Konferens

KonferensInternational Paper Physics Conference
Land/TerritoriumAustralien
OrtGold Coast
Period2007/05/062007/05/10