Improving stamps for 10 nm level wafer scale nanoimprint lithography

TY - JOUR

T1 - Improving stamps for 10 nm level wafer scale nanoimprint lithography

AU - Beck, Marc

AU - Graczyk, Mariusz

AU - Maximov, Ivan

AU - Sarwe, Eva-Lena

AU - Ling, TGI

AU - Keil, M

AU - Montelius, Lars

PY - 2002

Y1 - 2002

N2 - The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.

AB - The smaller the features on the stamp the more important are the interactions between stamp and polymer layer. A stamp rich in small structures will effectively show a surface area enlargement, which generally leads to adhesion of the polymer to the stamp. This makes a subsequent imprint impossible without troublesome and time-consuming cleaning. The anti-adhesion properties of Si- or SiO2-based stamps can be improved by binding fluorinated silanes covalently to the surface. In this paper, we demonstrate that the deposition procedure as well as the environment during deposition are important with respect to the quality and performance of the molecular layer. (C) 2002 Published by Elsevier Science B.V.

KW - nanoimprint lithography

KW - stamp

KW - fluorosilane

KW - anti-adhesion

U2 - 10.1016/S0167-9317(02)00464-1

DO - 10.1016/S0167-9317(02)00464-1

M3 - Article

VL - 61-2

SP - 441

EP - 448

JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 1873-5568

ER -