Sloped side walls in SU-8 structures with ‘Step-and-Flash’ processing

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We present a fast fabrication technique to achieve SU-8 structures with sloped side walls. We investigate the method of ‘Step-and-Flash’ which combines hot embossing with UV sensitive materials. The stamps are fabricated in Si by KOH etching to achieve mesa structures with side walls at a 54.7° angle to the bottom. These stamps are imprinted into SU-8-coated Pyrex wafers during the soft bake step of the SU-8 processing, under ambient conditions. The SU-8 is exposed through the Pyrex wafer and after a post exposure bake the stamp can be removed as the SU-8 is cross-linked – leaving stamp replicates in the SU-8. We have optimized the method and show that further processing of the structures is possible. We believe this method to be highly suitable for pattering sloped side wall structures in SU-8 as it can easily be incorporated into a standard SU-8 fabrication scheme without adding further process steps, as well as performed under ambient conditions.


  • Maria Nordström
  • Jörg Hübner
  • Anja Boisen
Externa organisationer
  • Technical University of Denmark

Ämnesklassifikation (UKÄ) – OBLIGATORISK

  • Medicinteknik
Sidor (från-till)1269-1272
TidskriftMicroelectronic Engineering
Utgåva nummer4/9
StatusPublished - 2006
Peer review utfördJa
Externt publiceradJa