Stress and displacement configurations in the vicinity of a void in a nanometer copper strip

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Abstract

Molecular dynamics is used to simulate nanometer-sized copper strips. The strips are highly constrained and chosen to mimic thin films between two stiff layers. Further, the strips hold centrally placed straight through crack shaped voids, and are subjected to tensile displacement controlled mode I loading. The tensile stresses and displacements are studied. It is found that if a copper strip is 2.16906. nm in a direction orthogonal to the loading direction, the strip does not experience plane strain conditions. However, if this dimension is ≥3.6151. nm, the strip shows states of both plane stress and plane strain.

Detaljer

Författare
Enheter & grupper
Forskningsområden

Ämnesklassifikation (UKÄ) – OBLIGATORISK

  • Maskinteknik

Nyckelord

Originalspråkengelska
Sidor (från-till)139-146
Antal sidor8
TidskriftEngineering Fracture Mechanics
Volym152
StatusPublished - 2016 feb 1
PublikationskategoriForskning
Peer review utfördJa

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Dan Johansson

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