Tensile behavior of single-crystal nano-sized copper beams with voids

Forskningsoutput: Kapitel i bok/rapport/Conference proceedingKonferenspaper i proceeding

Abstract

The tensile response under displacement controlled loading of nano-sized single crystal Cu beams, solid or holding square shaped through-the thickness voids, have been investigated through 3D molecular dynamics simulations using free-ware LAMMPS [1]. For the same beam size and void height, the void width along the beam length axis was varied. Two different crystallographic orientations were considered. It was found that, under some circumstances, voids were able to close and heal the beam cross section, causing final failure through necking in the region of the initial void. For other cases instead the void split in two, smaller voids that both eventually healed. A third scenario was that the void widened, splitting the beam in two ligaments that each necked individually. As expected, both defect geometry and crystal orientation influences the mechanical behavior.

Detaljer

Författare
Enheter & grupper
Forskningsområden

Ämnesklassifikation (UKÄ) – OBLIGATORISK

  • Teknisk mekanik

Nyckelord

Originalspråkengelska
Titel på värdpublikationMaterials Structure and Micromechanics of Fracture VIII
FörlagTrans Tech Publications Ltd
Sidor53-56
Antal sidor4
Volym258 SSP
ISBN (tryckt)9783038356264
StatusPublished - 2017
PublikationskategoriForskning
Peer review utfördJa
Evenemang8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Tjeckien
Varaktighet: 2016 jun 272016 jun 29

Publikationsserier

NamnSolid State Phenomena
Volym258 SSP
ISSN (elektroniskt)16629779

Konferens

Konferens8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
LandTjeckien
OrtBrno
Period2016/06/272016/06/29

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