Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics

    Forskningsoutput: Kapitel i bok/rapport/Conference proceedingKonferenspaper i proceedingPeer review

    Originalspråkengelska
    Titel på värdpublikationSimulating nanoindentation of thin Cu films using molecular dynamics and peridynamics
    Antal sidor4
    StatusPublished - 2016
    Evenemang8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Tjeckien
    Varaktighet: 2016 juni 272016 juni 29

    Publikationsserier

    NamnProseeding to  the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE

    Konferens

    Konferens8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
    Land/TerritoriumTjeckien
    OrtBrno
    Period2016/06/272016/06/29

    Ämnesklassifikation (UKÄ)

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