Simulating nanoindentation of thin Cu films using molecular dynamics and peridynamics

Forskningsoutput: Kapitel i bok/rapport/Conference proceedingKonferenspaper i proceedingPeer review

Originalspråkengelska
Titel på värdpublikationSimulating nanoindentation of thin Cu films using molecular dynamics and peridynamics
Antal sidor4
StatusPublished - 2016
Evenemang8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE - Brno, Tjeckien
Varaktighet: 2016 juni 272016 juni 29

Publikationsserier

NamnProseeding to  the 8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE

Konferens

Konferens8th International Conference on MATERIALS STRUCTURE & MICROMECHANICS OF FRACTURE
Land/TerritoriumTjeckien
OrtBrno
Period2016/06/272016/06/29

Ämnesklassifikation (UKÄ)

  • Teknisk mekanik

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