Stress analysis of highly constrained copper strips with through crack shaped voids using molecular dynamics

Dan Johansson, Per Hansson, Solveig Melin

Forskningsoutput: Kapitel i bok/rapport/Conference proceedingKonferenspaper i proceedingPeer review

Sammanfattning

A small rectangular strip of fcc Cu, containing a through crack on the nanoscale and subjected to loading under displacement control, is simulated using molecular dynamics (MD). The geometry is highly constrained and chosen to mimic that of a thin strip between two stiff layers. The Lennard-Jones pair potential is used for the inter-atomic forces. The centrally placed crack shaped void is created by removing a few atoms inside the specimen. The crack is loaded perpendicular to the crack plane and the tensile stress is studied as it varies over the thickness of the strip. Comparisons with finite element calculations are made and the goal is to find a limit in model size beneath which the finite element (FE) solutions and linear elastic fracture mechanics (LEFM) lose their accuracy.
Originalspråkengelska
Titel på värdpublikationMaterials Structure & Micromechanics of Fracture VII (Key Engineering Materials)
FörlagTrans Tech Publications
Sidor43-46
Volym592-593
DOI
StatusPublished - 2014
Evenemang7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7) - Brno, Tjeckien
Varaktighet: 2013 juli 12013 juli 3

Publikationsserier

Namn
Volym592-593
ISSN (tryckt)1013-9826

Konferens

Konferens7th International Conference on Materials Structure and Micromechanics of Fracture (MSMF 7)
Land/TerritoriumTjeckien
OrtBrno
Period2013/07/012013/07/03

Ämnesklassifikation (UKÄ)

  • Teknisk mekanik

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